Higher Density for New Compact PCB-to-PCB Designs

This Tech Bulletin provides an overview of evolving market requirements for interconnecting more compact PCB-to-PCB designs and introduces new smaller solderless SMT Press-Fit solutions designed for these high-density applications.


Topics addressed in this Tech Bulletin include:

  • SMT Press-Fit Edge Card Application Requirements
  • Integrating Advantages of SMT and Press-Fit Technologies
  • Existing 0.64mm SMT Press-Fit Interconnects
  • New High Density 0.40mm SMT Press-Fit Interconnects with 1.8mm Centerlines
  • Maximizing Mechanical Strength of SMT-to-PCB Connection

Download the Tech Bulletin